Dec 12, 2023 · DISCO CORPORATION, a semiconductor manufacturing equipment manufacturer (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya), has developed DDS2020, a fully …

DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …

DISCO’s Definition of Growth as a Company In addition, DISCO does not think of growth in terms of the expansion of the company’s sales, size, or market share. For DISCO, “growth” as …

DISCO's increasing size and complexity was the main reason for the introduction of the system. When a company is small, communication is fluid and most employees know each other.

Please contact a DISCO representative with your product needs such as type, wheel size, and quantity. When you place the first order with us, please explain application information such as …

DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. It performs a series of processes from HogoMax * coating and dicing to automatic cleaning. The …

NBC-Z Series Hubless Blade Electroformed bond Silicon wafer, Compound semiconductor wafers (GaAs, GaP, etc.), Various types of semiconductor packages, etc

Simple and compact single-axis grinder The DAG810 is a compact, automatic grinder for workpieces up to 8" in diameter. It has one spindle and one chuck table and is designed to …

UltraPoligrind employs an ultra-fine diamond abrasive to create higher die strength and enable grinding with even less damage than Poligrind. This new finish grinding wheel is also able to …