GlobalFoundries plans $575M advanced packaging facility in New York
GlobalFoundries (NASDAQ:GFS) has announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by up to $20M in aid from the State of New York and up to $75Min direct funding from the U.
GlobalFoundries to establish new center for advanced packaging and testing
Gov. Kathy Hochul announced that GlobalFoundries (GF), a leading manufacturer of semiconductors located in Saratoga County, will invest $575 million to create a new center for
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be $575 million, with an additional $186 million investment in research and development over the next 10-plus years. These efforts are expected to create approximately 100 new full-time GF jobs in New York over the next five years.
GlobalFoundries expanding with first-of-its-kind advanced packaging center in New York
Governor Kathy Hochul announced Friday that GlobalFoundries will invest $575 million to establish a new center for advanced packaging and testing.
GlobalFoundries Boosts New York's Tech Ecosystem with $575 Million Advanced Chip Center in Malta
GlobalFoundries invests $575 million in a new packaging and photonics center in Malta, NY, creating over 100 jobs.
Nvidia Expands Capacity with TSMC's Advanced Packaging
Nvidia continues to enhance its packaging technology with TSMC, shifting from CoWoS-S to CoWoS-L for its AI chips. The company aims to increase capacity, not reduce it, as demand grows. Jensen Huang,
Nvidia CEO says its advanced packaging technology needs are changing
Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S.
ASU-related projects nab $1.2 billion for new research tied to semiconductor packaging
The Commerce Department has awarded $1.2 billion to two ASU-related projects and facilities tied to the way semiconductors ...
Electronic Design19h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
US announces $1.4 bln support for next-generation semiconductor advanced packaging
The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of ...
Digi Times1d
Nvidia's visit to SPIL highlights its emphasis on advanced packaging
Nvidia CEO Jensen Huang's visit to Siliconware Precision Industries (SPIL) on his current trip to Taiwan has garnered market ...
Micron To Build $7 Billion Advanced Chip Facility In Singapore Amid AI Boom
Micron Technology is investing $7 billion to build an advanced chip packaging facility in Singapore as the semiconductor ...
Semiconductor Engineering1d
Advanced Packaging: A Curse Or A Blessing For Trustworthiness?
The field of advanced packaging in particular is undergoing significant change, and this presents both opportunities and ...
Digi Times11h
US govt commits US$1.4 billion to domestic chip packaging
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging ...