Researchers have published research detailing their development of an AI framework to detect defects in additively ...
The Department of Science and Technology (DOST) has unveiled new equipment capable of analyzing materials and detecting ...
A new wafer inspection platform combines AI analytics, sub-micron imaging, SWIR sensing, and precision metrology to help ...
Taiwan-based manufacturer of AI fabric inspection machines shows end-to-end fabric defect detection and data integration from inspection through spreading to cutting NEW TAIPEI CITY, April 30, 2026 ...
Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
TDK SensEI’s edgeRX Vision system, powered by advanced AI, accurately detects defects in components as small as 1.0×0.5 mm in real time. Operating at speeds up to 2000 parts per minute, it reduces ...
This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...
Bullen Ultrasonics Research and Early Innovation Manager Eric Norton to Speak at Ceramics Expo 2026 on Technology Transfer ...
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